礦ision Build Log
Tool Versions:
IDE-Version: μVision V5.23.0.0
Copyright (C) 2017 ARM Ltd and ARM Germany GmbH. All rights reserved.
License Information: Microsoft, Microsoft, LIC=D0DTG-V164K-V1NP8-3FC2P-BNK0Y-B5AVJ
 
Tool Versions:
Toolchain:       MDK-ARM Plus  Version: 5.23
Toolchain Path:  C:\Keil_v5\ARM\ARMCC\Bin
C Compiler:      Armcc.exe V5.06 update 4 (build 422)
Assembler:       Armasm.exe V5.06 update 4 (build 422)
Linker/Locator:  ArmLink.exe V5.06 update 4 (build 422)
Library Manager: ArmAr.exe V5.06 update 4 (build 422)
Hex Converter:   FromElf.exe V5.06 update 4 (build 422)
CPU DLL:         SARMCM3.DLL V5.23
Dialog DLL:      DCM.DLL V1.15.0.0
Target DLL:      STLink\ST-LINKIII-KEIL_SWO.dll V2.0.18.0
Dialog DLL:      TCM.DLL V1.27.0.0
 
Project:
D:\Desktop\H750\H750例程-HAL库\例21 内部温度传感器\USER\TEST.uvprojx
Project File Date:  08/28/2019

Output:
*** Using Compiler 'V5.06 update 4 (build 422)', folder: 'C:\Keil_v5\ARM\ARMCC\Bin'
Build target 'TEST'
"..\OBJ\ADC.axf" - 0 Error(s), 0 Warning(s).

Collection of Component include folders:
  .\RTE\_TEST
  C:\Keil_v5\ARM\PACK\Keil\STM32H7xx_DFP\2.3.0\Drivers\CMSIS\Device\ST\STM32H7xx\Include

Collection of Component Files used:
Build Time Elapsed:  00:00:01